Electronics tester with power saving state

ABSTRACT

The invention relates to a tester apparatus of the kind including a portable supporting structure for removably holding and testing a substrate carrying a microelectronic circuit. An interface on the stationary structure is connected to the first interface when the portable structure is held by the stationary structure and is disconnected from the first interface when the portable supporting structure is removed from the stationary structure. An electrical tester is connected through the interfaces so that signals may be transmitted between the electrical tester and the microelectronic circuit to test the microelectronic circuit.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority from U.S. Provisional PatentApplication No. 60/910,433, filed on Apr. 5, 2007, which is incorporatedherein by reference in its entirety.

BACKGROUND OF THE INVENTION 1). Field of the Invention

This invention relates to an apparatus that is used for full-wafertesting and/or burn-in testing and/or built-in self-testing.

2). Discussion of Related Art

Microelectronic circuits are usually fabricated in and on semiconductorwafers. Such a wafer is subsequently “singulated” or “diced” intoindividual dies. Such a die is typically mounted to a supportingsubstrate for purposes of providing rigidity thereto and electroniccommunication with an integrated or microelectronic circuit of the die.Final packaging may include encapsulation of the die and the resultingpackage can then be shipped to a customer.

It is required that the die or the package be tested before beingshipped to a customer. Ideally, the die should be tested at an earlystage for the purposes of identifying the defects that occur duringearly-stage manufacturing.

The earliest stage that a die can be tested is after completion of themanufacture of microelectronic circuits at wafer level and before awafer is singulated. Full wafer testing carries with it a number ofchallenges. One challenge in full wafer testing is that there is a largeamount of contacts on a wafer and that a large number of power, ground,and signal connections thus have to be made. Another challenge is thatburn-in testing requires a thermal management system that can maintainthe wafer stable at a relatively high temperature, while providing asystem that is simple to operate and relatively inexpensive.

SUMMARY OF THE INVENTION

A portable pack is provided, including a portable supporting structurefor holding a substrate carrying a microelectronic circuit and having aplurality of terminals connected to the microelectronic circuit, aplurality of contacts on the portable supporting structure, the contactsmatching the terminals for making contact to the terminals, a firstinterface on the portable supporting structure and connected to thecontacts, for connection to a second interface on a stationary structurewhen the portable supporting structure is removably held by thestationary structure.

The portable supporting structure may include first and secondcomponents for holding the substrate therebetween, the contacts locatedon the second component, and the components being movable relative toone another to ensure proper contact between the contacts and theterminals.

The second component may include a signal distribution board and acontactor, wherein a CTE ratio of a CTE of the signal distribution boardto a CTE of the contactor is not equal to 1. The contactor may heat froma first contactor temperature to a second contactor temperature duringtesting of the microelectronic circuit, and the signal distributionboard heats from a first signal distribution board temperature to asecond signal distribution board temperature, and a temperature changeratio, being a difference between the second signal distribution boardtemperature and the first signal distribution board temperature to adifference between the second contactor temperature and the firstcontactor temperature, multiplied by the CTE ratio, is closer to 1 thanthe CTE ratio.

The coefficient of thermal expansion ratio multiplied by the temperaturechange ratio may be between 0.8 and 1.2.

The first component may be a substrate chuck having a surface supportingthe substrate.

The portable pack may further include a pressure differential cavityseal between the first and second components, the pressure differentialcavity seal forming an enclosed pressure differential cavity togetherwith surfaces of the first and second components, and a pressurereduction passage within the pressure differential cavity through whichair can be removed from the pressure differential cavity to move thefirst and second components relatively towards one another.

The pressure differential cavity seal may surround the contacts and theterminals.

The pressure differential cavity seal may be secured to the firstcomponent when the first and second components are apart.

The pressure differential cavity seal may be a lip seal.

A pressure reduction passage may be formed through one of thecomponents, the pressure reduction passage having an inlet opening atthe pressure differential cavity and an outlet opening outside thepressure differential cavity, and a first valve in the component havingthe pressure reduction passage, opening of the first valve allowing airout of the pressure differential cavity and closing of the valve keepingair from entering the pressure differential cavity.

The first valve may be a check valve, a vacuum release passage beingformed through the component having the check valve, the vacuum releasepassage having an inlet opening at the pressure differential cavity andan outlet opening outside the pressure differential cavity, and asecond, vacuum release valve in the component having the vacuum releasepassage, opening of the vacuum release valve allowing air into thepressure differential cavity and closing of the valve keeping air fromescaping out of the pressure differential cavity.

The portable pack may further include a substrate suction passage in thefirst component, through which air can be pumped to reduce a pressure ona side of the substrate facing the first component to hold the substrateagainst the first component.

The contacts may be resiliently depressible by the terminals, theportable pack further including a stand-off on the second component, thestand-off having a surface that limits depression of at least one of thecontacts.

A plurality of separated stand-offs may be located between the contacts.

The portable pack may further include a layer having a first side thatis adhesive and attached to the second component, and a second, oppositeside that is adhesive, and the stand-off may be attached to the secondside.

The first interface may include a plurality of lands and the secondinterface may include a plurality of members having contact surfacesthat match with the lands, and are resiliently depressible by the lands,allowing for movement relative to the structure of the stationarystructure.

The lands and the terminals may be in parallel planes.

The substrate may be a wafer with a plurality of microelectroniccircuits.

The contacts may be pins, each pin having a spring that may be depressedagainst a spring force thereof when the respective contact is depressedby a respective one of the terminals.

The invention also relates to a tester apparatus of the kind including aportable supporting structure for holding a substrate carrying amicroelectronic circuit and having a plurality of terminals connected tothe microelectronic circuit, a plurality of contacts on the portablesupporting structure, the contacts matching the terminals for makingcontact to the terminals, a first interface on the portable supportingstructure and connected to the contacts, a stationary structure, theportable supporting structure being receivable to be held by thestationary structure and being removable from the stationary structure,a second interface on the stationary structure, the second interfacebeing connected to the first interface when the portable structure isheld by the stationary structure and being disconnected from the firstinterface when the portable supporting structure is removed from thestationary structure, and an electrical tester connected through thesecond interface, the first interface, and the contacts to the terminalsso that signals may be transmitted between the electrical tester and themicroelectronic circuit to test the microelectronic circuit.

The portable supporting structure may include first and secondcomponents for holding the substrate therebetween, the contacts locatedon the second component, and the components being movable relative toone another to ensure proper contact between the contacts and theterminals.

The second component may include a signal distribution board and acontactor, wherein a CTE ratio of a CTE of the signal distribution boardto a CTE of the contactor is not equal to 1. The contactor may heat froma first contactor temperature to a second contactor temperature duringtesting of the microelectronic circuit, and the signal distributionboard heats from a first signal distribution board temperature to asecond signal distribution board temperature, and a temperature changeratio, being a difference between the second signal distribution boardtemperature and the first signal distribution board temperature to adifference between the second contactor temperature and the firstcontactor temperature, multiplied by the CTE ratio, is closer to 1 thanthe CTE ratio.

The coefficient of thermal expansion ratio multiplied by the temperaturechange ratio may be between 0.8 and 1.2.

The first component may be a substrate chuck having a surface supportingthe substrate.

The tester apparatus may further include a pressure differential cavityseal between the first and second components, the pressure differentialcavity seal forming an enclosed pressure differential cavity togetherwith surfaces of the first and second components, and a pressurereduction passage within the pressure differential cavity through whichair can be removed from the pressure differential cavity to move thefirst and second components relatively towards one another.

The pressure differential cavity seal may surround the contacts and theterminals.

The pressure differential cavity seal may be secured to the firstcomponent when the first and second components are apart.

The pressure differential cavity seal may be a lip seal.

A pressure reduction passage may be formed through one of thecomponents, the pressure reduction passage having an inlet opening atthe pressure differential cavity and an outlet opening outside thepressure differential cavity, and a first valve in the component havingthe pressure reduction passage, opening of the first valve allowing airout of the pressure differential cavity and closing of the valve keepingair from entering the pressure differential cavity.

The first valve may be a check valve, a vacuum release passage beingformed through the component having the check valve, the vacuum releasepassage having an inlet opening at the pressure differential cavity andan outlet opening outside the pressure differential cavity, and asecond, vacuum release valve in the component having the vacuum releasepassage, opening of the vacuum release valve allowing air into thepressure differential cavity and closing of the valve keeping air fromescaping out of the pressure differential cavity.

The tester apparatus may further include a substrate suction passage inthe first component, through which air can be pumped to reduce apressure on a side of the substrate facing the first component to holdthe substrate against the first component.

The contacts may be resiliently depressible by the terminals, furtherincluding a stand-off on the second component, the stand-off having asurface that limits depression of at least one of the contacts.

A plurality of separated stand-offs may be located between the contacts.

The tester apparatus may further include a layer having a first sidethat is adhesive and attached to the second component, and a second,opposite side that is adhesive, and the stand-off may be attached to thesecond side.

The first interface may include a plurality of lands and the secondinterface may include a plurality of members having contact surfacesthat match with the lands and are resiliently depressible by the lands,allowing for movement relative to the structure of the stationarystructure.

The lands and the terminals may be in parallel planes.

The stationary structure may include a thermal chuck, the portablesupporting structure contacting the thermal chuck to allow for transferof heat between the portable supporting structure and the thermal chuck.

A thermal interface cavity may be defined between the portablesupporting structure and the thermal chuck, and a thermal interfacevacuum passage may be formed through the thermal chuck to the thermalinterface vacuum.

The tester apparatus may further include a thermal interface cavity sealcontacting both the portable supporting structure and the thermal chuck,so that the thermal interface cavity seal defines the thermal interfacecavity together with the portable supporting structure and the thermalchuck.

The tester apparatus may further include a thermal chuck on thestationary structure, the thermal chuck having a thermal control passagewith an inlet, an outlet, and at least one section between the inlet andthe outlet for a fluid to flow from the inlet to the outlet, heattransferring through the thermal chuck between the substrate and thefluid in the thermal control passage.

The thermal control passage may have first, second, and third sectionsin series after one another along a path of the fluid, and the thirdsection may be located between the first and second sections incross-sectional plan view.

The thermal control passage may have a fourth section in series afterthe third section along the path of the fluid, the fourth section beinglocated between the second and third sections.

The thermal control passage may have a fourth section in series afterthe third section along the path of the fluid, the fourth section beinglocated between the first and second sections.

The first, second, and third sections may be sections of a first spiral.

The first and second sections may be sections of a first spiral and thethird section may be a section of a second spiral that is located on thefirst spiral.

The tester apparatus may further include a heater, heat beingtransferred to the fluid by the heater when the fluid is outside thethermal control passage.

The heater may be an electric heater.

Heat may be transferred from the substrate to the fluid that enters thefluid inlet at above 21 degrees Celsius.

Heat may be first transferred from the fluid to the substrate after thefluid enters the fluid inlet at above 21 degrees Celsius.

The fluid may have a temperature above 100 degrees Celsius when thefluid enters the fluid inlet.

The fluid may be recirculated.

The tester apparatus may further include at least one interface actuatorhaving first and second actuator pieces that are actuable relative toone another to move the portable supporting structure relative to thestationary structure and engage the first interface with the secondinterface.

The first and second pieces may be a cylinder and a piston,respectively, the piston sliding along an internal surface of thecylinder.

The test that may be carried out on the microelectronic circuit by thetester may be a burn-in test.

The substrate may be a wafer with a plurality of microelectroniccircuits.

The contacts may be pins, each pin having a spring that may be depressedagainst a spring force thereof when the respective contact is depressedby a respective one of the terminals.

The invention also relates to a method of testing a microelectroniccircuit held by a substrate, including holding the substrate in aportable supporting structure having contacts against terminals of thesubstrate connected to the microelectronic circuit, receiving theportable supporting structure by a stationary structure with a firstinterface on the portable supporting structure connected to a secondinterface on the stationary structure, and transmitting signals betweenan electrical tester and the microelectronic circuit through theterminals, contacts, and first and second interfaces to test themicroelectronic circuit.

The substrate may be held between first and second components of theportable supporting structure and the contacts may be on the secondcomponent, further including moving the first and second componentsrelatively towards one another to ensure proper contact between thecontacts and the terminals.

The portable supporting structure together with the substrate mayinclude first and second elements, wherein a CTE ratio of a CTE of thefirst element to a CTE of the second element is not equal to 1.

The CTE ratio multiplied by the temperature change ratio is preferablybetween 0.8 and 1.2.

The first and second elements may be a signal distribution board and acontactor on the same side of the substrate.

One of the elements is the substrate

The first component may be a substrate chuck having a surface supportingthe substrate.

The method may further include locating a pressure differential cavityseal between the first and second components to form an enclosed cavityby surfaces of the first and second components and the pressuredifferential cavity seal, and reducing a pressure within the pressuredifferential cavity seal cavity to move the first and second componentsrelatively towards one another.

The pressure differential cavity seal may surround the contacts and theterminals.

The pressure differential cavity seal may be secured to the firstcomponent when the first and second components are apart.

The substrate cavity seal may be created with a lip seal.

A pressure reduction passage may be formed through one of thecomponents, the pressure reduction passage having an inlet opening atthe pressure differential cavity and an outlet opening outside thepressure differential cavity, and a first valve in the component havingthe pressure reduction passage, further including opening of the firstvalve to allow air out of the pressure differential cavity, and closingthe first valve, keeping air from entering the pressure differentialcavity.

The first valve may be a check valve, a vacuum release passage beingformed through the component having the check valve, the vacuum releasepassage having an inlet opening at the pressure differential cavity andan outlet opening outside the pressure differential cavity, and asecond, vacuum release valve in the component having the vacuum releasepassage, further including: opening of the vacuum release valve to allowair into the pressure differential cavity, and closing of the valve,keeping air from escaping out of the pressure differential cavity.

A pressure within the pressure differential cavity may be created beforethe portable supporting structure is received by the stationarystructure.

The method may further include pumping air through a substrate suctionpassage in the first component to reduce a pressure on a side of thesubstrate facing the first component and holding the substrate againstthe first component.

The contacts may be resiliently depressible by the terminals, furtherincluding limiting depression of at least one of the contacts with asurface of a stand-off on the second component.

A plurality of separated stand-offs may be located between the contacts.

The method may further include a layer having a first side that isadhesive and attached to the second component and a second, oppositeside that is adhesive, and the stand-off may be attached to the secondside.

The method may further include locating lands of a first interface onthe portable supporting structure against a plurality of matchingmembers of a second interface on the stationary structure, andresiliently depressing the members with the lands.

The method may further include locating a surface of the portablesupporting structure against a surface of a thermal chuck on thestationary structure, and transferring heat through the surfaces.

The method may further include reducing a pressure of air in a thermalinterface cavity defined between the surfaces of the portable supportingstructure and the thermal chuck.

A thermal interface cavity may be defined between the portablesupporting structure and the thermal chuck, and a thermal interfacevacuum passage may be formed through the thermal chuck to the thermalinterface vacuum.

The method may further include locating a thermal interface cavity sealbetween the portable supporting structure and the thermal chuck so thatthe thermal interface cavity may be defined by the thermal interfacecavity seal together with the portable supporting structure and thethermal chuck.

The method may further include passing a fluid from a fluid inlet to afluid outlet through at least one section of a thermal control passagein a thermal chuck on the stationary structure, and transferring heatbetween the fluid in the thermal control passage and the substrate tocontrol a temperature of the substrate.

The thermal control passage may have first, second, and third sectionsin series after one another along a path of the fluid, and the thirdsection may be located between the first and second sections incross-sectional plan view.

The thermal control passage may have a fourth section in series afterthe third section along the path of the fluid, the fourth section beinglocated between the second and third sections.

A temperature of the thermal chuck between the second and third sectionsmay be between a temperature of the fluid in the first and secondsections, and a temperature of the thermal chuck between the first andfourth sections may be between a temperature of the fluid in the firstand second sections.

There may be a larger temperature difference between the fluid in thefirst and fourth sections than between the fluid in the second and thirdsections.

The thermal control passage may have a fourth section in series afterthe third section along the path of the fluid, the fourth section beinglocated between the first and second sections.

The first, second, and third sections may be sections of a first spiral.

The first and second sections may be sections of a first spiral and thethird section may be a section of a second spiral that may not belocated on the first spiral.

The fluid may have a temperature above 21 degrees Celsius when the fluidenters the fluid inlet.

Heat may be transferred from the substrate to the fluid that enters thefluid inlet at above 21 degrees Celsius.

Heat may be first transferred from the fluid to the substrate after thefluid enters the fluid inlet at above 100 degrees Celsius.

The fluid may be recirculated.

The test that is carried out on the microelectronic circuit may be aburn-in test.

The substrate may be a wafer with a plurality of microelectroniccircuits.

The contacts may be pins, each pin having a spring that may be depressedagainst a spring force thereof when the respective contact may bedepressed by a respective one of the terminals.

The invention further provides a thermal control apparatus, including athermal chuck having a thermal control passage with an inlet, an outlet,and at least first, second, and third sections in series after oneanother along a path of the fluid from the fluid inlet to the fluidoutlet, and the third section is located between the first and secondsections in cross-sectional plan view.

The thermal control passage may have a fourth section in series afterthe third section along the path of the fluid, the fourth section beinglocated between the second and third sections.

The thermal control passage may have a fourth section in series afterthe third section along the path of the fluid, the fourth section beinglocated between the first and second sections.

The first, second, and third sections may be sections of a first spiral.

The first and second sections may be sections of a first spiral, and thethird section may be a section of a second spiral that is not located onthe first spiral.

The invention further relates to electrical aspects of a testerapparatus including an electrical tester for connection through thecontacts to a plurality of terminals of at least one substrate carryingat least one integrated circuit and having the terminals connected tothe integrated circuit so that current conducts between the electricaltester and the integrated circuit to test the integrated circuit.

The tester apparatus may further include a power supply circuitconnected to the contacts, wherein power is provided through the powersupply circuit connected to the contacts.

There may be a plurality of n plus one power supply circuits connectedto one another in parallel such that power is provided to the integratedcircuit by n plus one of the power supply circuits, and if one of thepower supplies fails, power is still provided to the integrated circuitby n of the circuits.

The tester apparatus may further include a current-sharing circuit that(i) detects at least a reduction in power of one of the n plus one powersupply circuits and (ii) switching a connection from the one of the nplus one power supply circuits off to eliminate current from the one ofthe n plus one power supply circuits so that current is shared by the npower supply circuits.

The current-sharing circuit may include a plurality of fault-detectioncircuits, each detecting power loss from a respective one of the powersupply circuits.

The tester apparatus may further include a power supply control circuitpowered from at least one of a plurality of power supply circuits, thepower supply control circuit switching the power supply circuits betweena test mode wherein power is provided by a first number of the pluralityof power supply circuits, and a power-save mode wherein power isprovided by a second number of the power supply circuits, the secondnumber being less than the first number.

The tester apparatus may further include a current configuration circuitthat is configurable to switch current switching between a firstconfiguration wherein separate current at different magnitudes isprovided to separate channels, and a second configuration whereincurrents to separate channels follow a common reference.

The current configuration circuit may include a plurality of currentamplifiers, each current amplifier having output current that follows aseparate reference when the current configuration circuit is in thefirst configuration.

The tester apparatus may further include a current amplifier thatamplifies current to separate channels.

The tester apparatus may further include signal electronics that providesignals to the integrated circuit.

The tester apparatus may further include a supporting structure forholding the at least one substrate, and a plurality of contacts matchingthe terminals for making contact to the terminals, the electrical testerbeing connected through the contacts to the terminals so that currentconducts between the electrical tester and the integrated circuit totest the integrated circuit.

The invention also relates to electrical aspects of a method of testingat least one circuit held by at least one substrate, including locatingcontacts against terminals of the substrate connected to the integratedcircuit, and conducting current between an electrical tester and theintegrated circuit through the terminals and contacts to test theintegrated circuit.

Power may be provided through a power supply circuit connected to thecontacts.

There may be a plurality of n plus one power supply circuits connectedto one another in parallel such that power may be provided to theintegrated circuit of the at least one substrate by n plus one of thepower supply circuits, still providing current to the integrated circuitby n of the circuits upon failure of one of the power supply circuits.

The method may further include detecting at least a reduction in powerof one of the n plus one power supply circuits, and switching aconnection from the one of the n plus one power supply circuits off toeliminate current from the one of the n plus one power supply circuitsso that current may be shared by the n power supply circuits.

The method may further include detecting power loss from each one of thepower supply circuits with a separate fault-detection circuit.

The method may further include providing power from at least one of aplurality of power supply circuits to a power supply control circuit,and utilizing the power supply control circuit to switch between a testmode wherein power may be provided by a first number of the plurality ofpower supply circuits, and a power save mode wherein power may beprovided by a second number of the power supply circuits, the secondnumber being less than the first number.

The method may further include switching between a first configurationwherein separate current at different magnitudes may be provided toseparate channels, and a second configuration wherein currents toseparate channels follow a common reference.

The current configuration circuit may include a plurality of currentamplifiers, each current amplifier having output current that follows aseparate reference, the current configuration circuit being in the firstconfiguration.

The method may further include amplifying current to separate channels.

The method may further include providing signals to the integratedcircuit.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention is further described by way of example with reference tothe accompanying drawings wherein:

FIG. 1 is a perspective view of wafer chuck assembly;

FIG. 2 is a cross-sectional side view on 2-2 in FIG. 1 of a portion ofthe wafer chuck assembly and a portion of a wafer substrate, whereinvertical dimensions of the wafer substrate are exaggerated for purposesof illustration;

FIG. 3 is a perspective view of a portable pack, according to anembodiment of the invention, which includes the wafer chuck assembly anddistribution board assembly;

FIG. 4 is a perspective view from below the portable pack;

FIG. 5 is a view similar to FIG. 4 after the portable pack is assembled;

FIG. 6 is a cross-sectional side view on 6-6 in FIG. 5 of the portablepack;

FIG. 7 is a cross-sectional side view of the portable pack andcomponents of a stationary structure, including a signal distributionboard, a contactor, and a thermal chuck, illustrating primarilyelectrical detail;

FIG. 8 is a cross-sectional side view of components of the stationarystructure and the portable pack, illustrating primarily structuraldetail;

FIG. 9 is a perspective view of the thermal chuck and the componentsattached to the thermal chuck;

FIG. 10 is a diagram illustrating components of a tester apparatusaccording to an embodiment of the invention;

FIG. 11 is a plan view of one electric tester shown in FIG. 10;

FIG. 12 is a block diagram of a configurable power board of the electrictester of FIG. 11;

FIG. 13A is a circuit diagram of a power supply circuit and apower-sharing circuit of the configurable power board of FIG. 12;

FIG. 13B is a circuit diagram of a voltage masters DACS and MUXEScircuit of the configurable power board of FIG. 12;

FIG. 13C is a circuit diagram of a “primary” group of high-currentslaves of the configurable power board of FIG. 12;

FIG. 14 is a circuit diagram of one of six current amplifiers of theprimary group of FIG. 13C; and

FIG. 15 is a circuit diagram of a voltage and current amplifier of onehigh-voltage slave of the configurable power board of FIG. 12.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 of the accompanying drawings illustrates a wafer chuck assembly10 in perspective view, and FIG. 2 illustrates a portion of the waferchuck assembly 10 in cross-sectional side view. The wafer chuck assembly10 includes a wafer chuck component 12, a pressure differentialsubstrate cavity seal 14, an offset ring 16, and a substrate suctionpassage valve 18.

The wafer chuck component 12 is made of aluminum or another metal havingrelatively high thermal conductivity and has a predetermined, relativelylow coefficient of thermal expansion. The wafer chuck component 12 has acircular outer surface 20 and upper and lower surfaces 22 and 24. Thediameter of the outer surface 20 is typically between 350 and 450 mm,more typically approximately 400 mm. The upper surface 22 has a numberof grooves formed therein and extends up to the outer surface 20. Thelower surface 24 is also formed in a single plane that extends up to theouter surface 20. The planes of the upper and lower surfaces 22 and 24are parallel to one another. The lower surface 24 has the same surfacearea as the upper surface 22.

The offset ring 16 has an upper surface 26 and a lower surface 28. Thelower surface 28 of the offset ring 16 is positioned on top of the uppersurface 22 of the wafer chuck component 12, and the offset ring 16 issecured to the wafer chuck component 12 with fasteners 30. The uppersurface 26 of the offset ring 16 is thus in a plane that is verticallyspaced from the plane of the upper surface 22 of the wafer chuckcomponent 12.

The offset ring 16 also has inner and outer surfaces 32 and 34. Theinner surface 32 together with a central portion of the upper surface 22of the wafer chuck component 12 define a circular recess 36 forreceiving a wafer having a circular outer edge. In the illustrationprovided, the wafer would have a diameter of approximately 200 mm.Larger wafers can be accommodated by removing the offset ring 16.

The substrate cavity seal 14 is formed into a closed circular loop thatentirely surrounds the offset ring 16 and the recess 36 for the wafer.The substrate cavity seal 14 is a lip seal having a lower anchor portion40 and an upper lip 42. The lower anchor portion 40 is secured within agroove formed in an outer region of the upper surface 22 of the waferchuck component 12. The lower anchor portion 40 anchors within thegroove due to thermo-elastic properties of the substrate cavity seal 14.The lip 42 has an upper surface 46 in a plane that is vertically spacedfrom the plane of the upper surface 26 of the offset ring 16. The uppersurface 46 of the lip 42 is resiliently depressible in a directiontowards the wafer chuck component 12. A pressure that is applied to theupper surface 46 bends the lip 42 so that the upper surface 46 moves ina downward direction, and the upper surface 46 moves in an upwarddirection due to resiliency of the lip 42 when the pressure is removed.

A substrate suction passage 50 is formed within the wafer chuckcomponent 12. The substrate suction passage 50 includes first, second,and third portions 52, 54, and 56. The first portion 52 is drilled fromthe outer surface towards a center of the wafer chuck component 12. Thesecond portion 54 has a length that is approximately one-third of adiameter of the outer surface 20 of the wafer chuck component 12. Thefirst portion 52 is drilled from the upper surface 22 of the wafer chuckcomponent 12, the first portion 52 forming an air inlet opening 60 atthe upper surface 22 of the wafer chuck component 12. The third portion56 is drilled from the lower surface 24 of the wafer chuck component 12,near a periphery of the lower surface 24, to the second portion 54. Thethird portion 56 forms an air outlet opening 62 at the lower surface 24.

Three circular grooves 64, 66, and 68 and a slot 70 are formed in theupper surface 22 of the wafer chuck component 12. The circular grooves64, 66, and 68 are concentric with center points that coincide with acenter point of the outer surface 20 of the wafer chuck component 12.The slot 70 is formed to the same depth as the circular grooves 64, 66,and 68 and connects the circular grooves 64, 66, and 68 with oneanother. The air inlet opening 60 is located within the slot 70 betweenthe circular grooves 66 and 68.

The substrate suction passage valve 18 is a shuttle valve that isinserted from the outer surface 20 of the wafer chuck component 12 intothe second portion 54 of the substrate suction passage 50, and thesecond portion 54 of the substrate suction passage is then closed with aplug 72. The substrate suction passage valve 18 has a seat 74 and a ballvalve component 76. When a pressure at the air outlet opening 62 islower than a pressure at the air inlet opening 60, the ball valvecomponent 76 lifts off the seat 74 to allow air to flow from the airinlet opening 60 to the air outlet opening 62. The ball valve component76 rests on the seat 74 when the pressure at the air inlet opening 60 islower than at the air outlet opening 62, thereby preventing air fromflowing from the air outlet opening 62 to the air inlet opening 60.

A pressure release opening 80 is formed into the lower surface 24 of thewafer chuck component 12, and connects with the second portion 54 of thesubstrate suction passage 50 on a side of the substrate suction passagevalve 18 opposing the air inlet opening 60. In a situation where thepressure at the air inlet opening 60 is lower than at the air outletopening 62, and the ball valve component 76 rests on the seat 74, apressure at the release opening 80 can be reduced to below the tippressure at the air inlet opening 60 so that the ball valve component 76lifts off the seat 74. When the ball valve component 76 lifts off theseat 74, air flows from the air inlet opening 60 past the ball valvecomponent 76 to the air outlet opening 62.

FIG. 2 further illustrates a wafer substrate 82 before it is inserted inthe wafer chuck assembly 10. Vertical dimensions of the wafer substrate82 are enlarged for purposes of illustration. The wafer substrate 82 hasan upper surface 84, a parallel lower surface 86, and a circular edge88. The wafer substrate 82 also includes a plurality of integratedmicroelectronic circuits 90 formed below the upper surface 84 and spacedfrom the lower surface 86. Each integrated microelectronic circuit 90includes a plurality of electronic components such as capacitors,diodes, and/or transistors that are interconnected with one anotherusing metal lines, plugs, and vias. The wafer substrate 82 also has aplurality of metal terminals 92 at the upper surface 84. In the presentexample, the terminals 92 have upper surfaces that form a plane that isslightly above the upper surface 84. In the present example, therefore,the total thickness of the wafer substrate 82 is measured from the lowersurface 86 to an upper surface of one of the terminals 92. Each one ofthe integrated microelectronic circuits 90 has a plurality of theterminals 92 connected thereto.

In use, the air inlet opening 60 and the release opening 80 are held atambient pressure. The wafer substrate 82 is then located within therecess 36. The lower surface 86 of the wafer substrate 82 is positionedon top of the upper surface 22 of the wafer chuck component 12. An edge88 of the wafer substrate 82 fits within the inner surface 32 of theoffset ring 16.

A small enclosed space is defined between the slot 70 and the lowersurface 86. With reference to FIGS. 1 and 2, the enclosed space extendsto the circular grooves 64, 66, and 68, which are closed by the lowersurface 86 of the wafer substrate 82 from the top. A pump is connectedto the air outlet opening 62 and is used to reduce the pressure at theair outlet opening 62 to below ambient pressure. The pressure at the airoutlet opening 62 is then below the pressure at the air inlet opening60, so that the ball valve component 76 lifts off the seat 74. A smallamount of air is pumped out of the enclosed cavity defined by thecircular grooves 64, 66, 68 and the slot 70 through the substratesuction passage 50, through the substrate suction passage valve 18, andout of the air outlet opening 62. The enclosed cavity defined by thecircular grooves 64, 66, and 68 and the slot 70 is then at below ambientpressure. The upper surface 84 of the wafer substrate 82 is at ambientpressure. The lower pressure on the lower surface 86 than at the uppersurface 84 of the wafer substrate 82 holds the lower surface 86 of thewafer substrate 82 against the upper surface 22 of the wafer chuckcomponent 12. Alignment of the wafer substrate 82, and in particular ofthe terminals 92 relative to the wafer chuck assembly 10, is maintainedby holding the wafer substrate 82 against the upper surface 22 of thewafer chuck component 12.

The air outlet opening 62 can then again be brought to ambient pressure.Because the air inlet opening 60 is still at below ambient pressure, theball valve component 76 remains on the seat 74 even after the air outletopening 62 returns to ambient pressure. Should it at any time becomenecessary to remove the wafer substrate 82 from the wafer chuck assembly10, the release opening 80 can be brought to a pressure that is belowthe pressure of the air inlet opening 60. The air inlet opening 60 isthen at a higher pressure than the release opening 80, so that the ballvalve component 76 lifts off the seat 74. The air inlet opening 60 isthen connected to the air outlet opening and a small amount of air flowsfrom the air outlet opening to the air inlet opening 60 and into thecircular grooves 64, 66, and 68 and into the slot 70. The lower surface86 of the wafer substrate 82 is thereby brought to ambient pressure, andthus to the same pressure as the upper surface 84 of the wafer substrate82. The wafer substrate 82 can then be removed from the wafer chuckassembly 10.

FIGS. 3 and 4 illustrate a portable pack 108 for holding the wafersubstrate 82, including the wafer chuck assembly 10 and a distributionboard assembly 110. FIGS. 3 and 4 do not illustrate electrical paths,including contacts, interfaces and vias, of the distribution boardassembly 110 in detail. As such, only a structural component of thedistribution board assembly 110 is illustrated. The structural componentincludes a metal backing plate 114, a signal distribution board 116, anda backing member 118 of a contactor.

The metal backing plate 114 has a substantially square shape. A circularopening 120 is formed within the metal backing plate 114. Two opposingedges 122 of the metal backing plate 114 are machined down so that therest of the metal backing plate 114 is slightly thicker than theopposing edges 122, and each opposing edge 122 defines a respectiveflange.

The signal distribution board 116 includes a substrate 124 having asubstantially square shape that is slightly smaller than the metalbacking plate 114. The signal distribution board 116 is positionedbetween the flanges defined by the opposing edges 122, and fasteners 126are used to secure the substrate 124 to the metal backing plate 114.

The backing member 118 of the contactor is circular and is positionedcentrally on the substrate 124 opposing the signal distribution board116. A clamp ring 128 is positioned over an edge of the backing member118. Fasteners 130 are used to secure the clamp ring to the substrate124 of the signal distribution board 116. The clamp ring 128 has anouter edge that is larger than the backing member 118 of the contactorand an inner edge that is slightly smaller than the backing member 118of the contactor. Because of the dimensions of the clamp ring 128, theclamp ring 128 secures the backing member 118 of the contactor to thesubstrate 124 of the signal distribution board 116. The clamp ring 128has an outer diameter that is slightly smaller than the diameter of theinner surface 32 of the offset ring 16 of the wafer chuck assembly 10.

The signal distribution board 116 further has a gold metal seat 134 onthe substrate 124. The gold metal seat 134 is in the form of a ringhaving inner and outer diameters that are respectively slightly smallerand slightly larger than a diameter of the upper surface 46 of thesubstrate cavity seal 14.

The components of the distribution board assembly 110 all have similar,relatively high coefficients of thermal expansion.

FIG. 5 illustrates the portable pack 108 after the distribution boardassembly 110 is positioned on top of the wafer chuck assembly 10. Thegold metal seat 134 is located at the bottom of the distribution boardassembly 110 and is positioned on top of the substrate cavity seal 14located at the top of the wafer chuck assembly 10.

Referring now to FIG. 6, the substrate cavity seal 14 is located betweenthe wafer chuck component 12 at the bottom and the substrate 124 of thesignal distribution board 116 at the top. The wafer chuck component 12,the substrate cavity seal 14, and the substrate 124 of the signaldistribution board 116 jointly define an enclosed pressure differentialcavity 140. The pressure differential cavity 140 extends to a spacebetween the wafer substrate 82 and the backing member 118 of thecontactor. Before the lip 42 of the substrate cavity seal 14 isdeflected, the pressure differential cavity 140 also extends to a spacebetween the offset ring 16 of the wafer chuck assembly 10 and thesubstrate 124 of the signal distribution board 116. The pressuredifferential cavity 140 also extends into a circular groove 142 formedon the upper surface 22 of the wafer chuck component 12, and a raisedportion of the clamp ring 128 is positioned within the groove 142. Asmall space is provided between a lower surface of the clamp ring 128and an upper surface of the groove 142 to allow for communicationbetween inner and outer volumes of the pressure differential cavity 140within and outside of the clamp ring 128.

A pressure reduction passage 144 is formed within the wafer chuckcomponent 12, and a pressure reduction passage check valve 146 islocated within the pressure reduction passage 144. The pressurereduction passage 144 includes first, second, and third portions 148,150, and 152. The first portion 148 is drilled from the upper surface 22of the wafer chuck component 12 and forms an inlet opening 154 at theupper surface 22. The third portion 152 is drilled from the lowersurface 24 of the wafer chuck component 12 and forms an outlet opening156 at the lower surface 24. The second portion 150 is drilled from theouter surface 20 of the wafer chuck component 12 and connects the firstand second portions 148 and 150 to one another. The pressure reductionpassage check valve 146 is inserted from the outer surface 20 of thewafer chuck component 12 into the second portion 150, and a plug 158 isused to close an entry of the second portion 150 at the outer surface20.

The pressure reduction passage check valve has a valve component 162 anda seat 164. The valve component 162 lifts off the seat 164 when airflows from the inlet opening 154 to the outlet opening 156. Air isprevented from flowing from the outlet opening 156 to the inlet opening154 because the valve component 162 rests on the seat 164.

The offset ring 16 has a plurality of slots 168 formed in a lower sidethereof. One of the slots 168 is shown in cross-section in FIG. 6 andconnects the inlet opening 154 of the pressure reduction passage 144 tothe pressure differential cavity 140. Further slots 168 extend radiallytowards a center of the offset ring 16 and are also connected to theinlet opening 154 of the pressure reduction passage 144 with a circulargroove 142 in a lower side of the offset ring 16.

In use, the pressure differential cavity 140 is initially at ambientpressure, and the outlet opening 156 is connected to a pump so that theoutlet opening 156 is at below ambient pressure. A pressure differentialis thus created between the air inlet opening 154 and the outlet opening156 so that air is pumped from the pressure differential cavity 140through the pressure reduction passage check valve 146 in the pressurereduction passage 144. The pressure within the pressure differentialcavity 140 drops to below ambient pressure. A pressure outside of theportable pack 108 remains at ambient pressure, so that a pressuredifferential is created wherein the pressure within the pressuredifferential cavity 140 is lower than a pressure above the substrate 124of the signal distribution board 116 and a pressure below the lowersurface 24 of the wafer chuck component 12. The pressure differentialcauses deflection of the lip 42 of the substrate cavity seal 14 and areduction in a vertical height of the pressure differential cavity 140.

The vertical height of the pressure differential cavity 140 continues todecrease until a lower surface of the substrate 124 of the signaldistribution board 116 comes into contact with an upper surface of theoffset ring 16. The offset ring 16 thus limits movement of the substrate124 of the signal distribution board 116 and the wafer chuck component12 relatively towards one another.

The outlet opening 156 can then again be brought to ambient pressure andcan be disconnected from the pump. The valve component 162 rests on theseat 164, and prevents air from entering into the pressure differentialcavity 140 through the pressure reduction passage 144. The pressuredifferential cavity 140 thereby maintains its reduced size, wherein thesubstrate 124 of the signal distribution board 116 contacts the offsetring 16. The portable pack 108 can then be removed from any apparatusthat is used to connect a pump to the outlet opening 156 and reduce thepressure within the pressure differential cavity 140 and can betransported to a tester at the subsystem.

As shown in FIG. 7, the backing member 118 forms part of a contactor170, and the contactor 170 further includes a plurality of pins 172,stand-offs 174, and adhesive 176.

Each one of the pins 172 has first and second components 178 and 179 anda respective spring 182. The first component 178 has a cavity thereinand the spring 182 is located in the cavity. A portion of the secondcomponent 179 is also located within the cavity holding the spring 182.The first and second components 178 and 179 are mounted to one anotherand can move relative to one another. Movement of a terminal of thesecond component 179 relatively towards a terminal of the firstcomponent 178 compresses the spring 182. Movement of the terminals ofthe first and second components 178 and 179 towards one another thusrequires a force to overcome a spring force of the spring 182. The forceensures proper contact between the pins 172 and the terminals 92 of thewafer substrate 82. When the force is removed, the terminals of thefirst and second components 178 and 179 move away from one another dueto a spring force of the spring 182. In an alternative embodiment, aspring force can be created by a component such as a membrane or anotherspring that is not a coil spring.

The backing member 118 is formed into two halves, and each half has arespective set of openings formed therein. One of the terminals of oneof the pins 172 is inserted through one opening in one of the halves ofthe backing member 118, and the other terminal of the pin 172 isinserted through one of the openings in the other half of the backingmember 118. The terminals of each pin 172 are inserted through arespective pair of openings in the two halves of the backing member 118.The pins 172 are retained within the backing member 118 when the halvesof the backing member 118 are secured to one another. The terminals ofthe pins 172 form a respective array of contacts 184 at the bottom ofthe contactor 170 and a corresponding array of contacts 186 at the topof the contactor 170.

The signal distribution board 116, in addition to the substrate 124,further includes a plurality of contacts 188, a plurality of lands 193,and a plurality of metal lines 191. The contacts 188 and the lands 193are located on the same side of the substrate 124. The contacts 188 arewithin the substrate cavity seal 14 shown in FIG. 4, and the lands 193are outside the substrate cavity seal 14. Each one of the metal lines191 connects a respective one of the contacts 188 with a respective oneof the lands 193. A respective conductor is thus formed by a respectivecontact 188, a respective metal line 191, and a respective land 193 ofthe signal distribution board 116. A respective one of the contacts 186of the contactor 170 contacts a respective one of the contacts 188 ofthe signal distribution board 116 when the backing member 118 of thecontactor 170 is secured to the substrate 124 of the signal distributionboard 116.

The stand-offs 174 are thin layers of material that are attached to alower surface of the backing member 118 of the contactor 170. Theadhesive 176 is a layer having upper and lower adhesive surfaces. Alower adhesive surface of the adhesive 176 is attached to an uppersurface of one of the stand-offs 174. An upper adhesive surface of theadhesive 176 is attached to a lower surface of the backing member 118 ofthe contactor 170, thereby attaching the stand-off 174 to the backingmember 118 of the contactor 170.

When the pressure within the pressure differential cavity 140 in FIG. 6is reduced, the stand-offs 174 also move closer to the wafer substrate82. Such movement of the stand-offs 174 towards the wafer substrate 82causes resilient depression of the contacts 184 of the contactor 170 bythe terminals 92 of the wafer substrate 82. Lower surfaces of thestand-offs 174 then come into contact with the upper surface 84 of thewafer substrate 82. The lower surfaces of the stand-offs 174 therebylimit depression of the contacts 184 into the backing member 118 of thecontactor 170. A plurality of separated stand-offs 174 are locatedbetween the contacts 184.

A plurality of conductive paths is created. Each conductive pathincludes a respective one of the terminals 92 of the wafer substrate 82,a respective pin 172 of the contactor 170, and a respective contact 188,metal line 191, and land 193 of the signal distribution board 116. Thelands 193 and the contacts 188 of the signal distribution board 116 arein a plane that is parallel to a plane of the terminals 92 of the wafersubstrate 82. Referring again to FIG. 1, a portable supporting structureis provided jointly by the wafer chuck component 12 at the bottom andthe structural component of the distribution board assembly 110 at thetop, with the wafer substrate 82 between the wafer chuck component 12and the structural component of the distribution board assembly 110.Referring again to FIG. 7, electric contact to the terminals 92 of thewafer substrate 82 is provided by the contacts 184 of the contactor 170,and the distribution board assembly 110 has an interface formed by thelands 193 for purposes of connection to another device. The portablepack 108 as shown in FIGS. 4 to 7 is now transported to a test systemthat can make contact to the interface formed by the lands 193 andprovide test signals, power, and ground to the wafer substrate 82. Thecontacts 184 of the contactor 170 and the terminals 92 of the wafersubstrate 82 are entirely surrounded by the substrate cavity seal 14,and are thus kept free of contaminants or moisture.

As illustrated in FIG. 8, the portable pack 108 is received by astationary structure 180. The stationary structure 180 has a frame 181that is positioned in a stationary location in a system (not shown).Components of the stationary structure 180 are movable relative to oneanother. The stationary structure 180, in addition to the frame 181,includes a holding structure 185 for receiving the portable pack 108,four actuators 187 (only one of which is shown), an interface assembly189, a thermal chuck 190, and a mounting arrangement 192 for the thermalchuck 190.

The actuator 187 includes a cylinder 194, a piston 196 in the cylinder194, and a connecting piece 198 connected to the piston 196. The piston196 can slide vertically up and down within the cylinder 194, and apressure can be increased and decreased behind this piston 196 as wellas in front of the piston 196 to move the piston in vertical upward anddownward directions. The connecting piece 198 has a lower end mounted tothe piston 196 and an upper end mounted to the holding structure 185.The holding structure 185 thus moves up and down together with thepiston 196.

The interface assembly 189 has an interface assembly substrate 200 and aplurality of pins 202. The pins 202 are held within the interfaceassembly substrate 200. The interface assembly substrate 200 is securedto an upper surface of the frame 181. The interface assembly substrate200 and the frame 181 define a circular opening 204 that is slightlylarger than a diameter of the outer surface 20 of wafer chuck component12.

A horizontal slot 205 is formed in an inner side of the holdingstructure 185. A similar slot (not shown) is formed in another portionof the holding structure 185. The flange on the edge 122 of the metalbacking plate 114 of the distribution board assembly 110 is insertedinto the slot 205 in a direction into the paper. The opposite edge (seeFIG. 3) is simultaneously inserted into the other slot of the holdingstructure 185. The portable pack 108 is then suspended by opposingportions of the holding structure 185. The slot 205 holds the flangeformed at the edge 122 to prevent upward or downward vertical movementof the portable pack 108 relative to the holding structure 185. When thepiston 196 moves down within the cylinder 194, the holding structure 185also moves down, and the portable pack 108 moves down into contact withthe interface assembly 189 of the stationary structure 180.

Referring again to FIG. 7, components of the stationary structure 180 ofFIG. 8 are shown, including the interface assembly 189 and a signal andpower board 206. Each one of the pins 202 includes first and secondcomponents 208 and 210 and a spring 212. The second component 210 has aportion that is located within a portion of the first component 208. Thespring 212 is also located within the portion of the first component208. The pin 202 has two opposing contacts, respectively on the firstand second components 208 and 210. Movement of the contacts towards oneanother requires a force that compresses the spring 212 against a springforce of the spring 212. The contacts move away from one another whenthe force that compresses the spring 212 is removed.

The interface assembly substrate 200 has two halves with a plurality ofopenings formed in each half. A pin portion of a first component 208 anda pin portion of a second component 210 are inserted into facingopenings of the two halves. Each pin 202 thus has a contact at the topand a contact at the bottom of the interface assembly 189.

The signal and power board 206 has a substrate 214, a plurality ofcontacts 216, and a plurality of metal leads 218 in the form of traces,metal lines, and and/or vias. The contacts 216 are formed on an uppersurface of the substrate 214. The metal leads 218 are connected to thecontacts 216.

The interface assembly substrate 200 is mounted to the substrate 214 ofthe signal and power board 206. A contact of each first component 208 ofeach pin 202 makes contact with a respective contact 216 of the signaland power board 206. The interface assembly 189 shown in FIG. 7 ismounted through the signal and power board 206 to the frame 181 shown inFIG. 8. When the portable pack 108 moves down into contact with theinterface assembly 189, each one of the lands 193 of the signaldistribution board 116 makes contact with a respective contact on arespective second component 210 of a respective pin 202 of the interfaceassembly 189. The lands 193 depress the contacts at the top of the pins202 upon further movement of the portable pack 108 in a downwarddirection. A force created by the actuators 187 in FIG. 8 ensures propercontact between the lands 193 and the pins 202.

The terminals of the wafer substrate 82 are then connected through thepins 172 of the contactor 170, the contacts 188, metal lines 191, andlands 193 of the signal distribution board 116, and the pins 202 of theinterface assembly 189 to the contacts 216 and metal leads 218 of thesignal and power board 206.

Referring again specifically to FIG. 8, the mounting arrangement 192includes a plurality of mounting pieces 220 (only one of which isshown), and a spring arrangement 224. The thermal chuck 190 is mountedthrough each one of the mounting pieces 220 and a respective springarrangement 224 to the frame 181.

Downward movement of the portable pack 108 brings the lower surface 24of the wafer chuck component 12 into contact with an upper surface ofthe thermal chuck 190. Slight differences in planarity between the lowersurface 24 of the wafer chuck component 12 and the upper surface of thethermal chuck 190 are taken up by the spring arrangement 224.

FIG. 9 shows the thermal chuck 190, the mounting pieces 220, a thermalinterface cavity seal 226, and two adaptors 228 and 230.

The thermal interface cavity seal 222 is an 0 ring seal formed in acircular groove 242 in an upper surface 232 of the thermal chuck 190.The thermal interface cavity seal 226 forms a closed loop around acenter point of the thermal chuck 190. Approximately two-thirds of thethermal interface cavity seal 226 is inserted into its groove in theupper surface 232 of the thermal chuck 190, and approximately one-thirdof the thermal interface cavity seal 226 remains above the upper surface232. The groove for the thermal interface cavity seal 222 isapproximately rectangular in cross-section and can accommodate theentire thermal interface cavity seal 226. If the third of the thermalinterface cavity seal 226 above the upper surface 232 is compressed intothe groove, an upper surface of the thermal interface cavity seal 226will then be in the same plane as the upper surface 232.

A thermal interface vacuum passage 234 is formed from the upper surface232 to a lower surface 236 of the thermal chuck 190. A plurality ofvacuum grooves 240 are formed in the upper surface 232 of the thermalchuck 190 in an area within the thermal interface cavity seal 226. Thethermal interface vacuum passage 234 has an inlet opening within one ofthe vacuum grooves 240. One of the vacuum grooves 240 is a slot thatextends radially from a center point of the upper surface 232 of thethermal chuck 190. Four of the vacuum grooves 240 are concentric ringswith center points at a center point of the upper surface 232 of thethermal chuck 190. The vacuum grooves 240 are connected to one anotherand thus form a single interconnected cavity below the upper surface ofthe thermal chuck 190.

A vacuum port 242 is formed from the upper surface 232 to the lowersurface 236 in an area of the upper surface 232 outside the thermalinterface cavity seal 226. A vacuum port seal 244 is formed into agroove that surrounds the vacuum port 242. The vacuum port 242 isaligned with and connected to the outlet opening 156 of the pressurereduction passage 144 in the wafer chuck component 12 shown in FIG. 6.

In use, the lower surface 24 of the wafer chuck component 12 in FIG. 6contacts the thermal interface cavity seal 226 and the vacuum port seal244 shown in FIG. 9. A thermal interface cavity is defined at the bottomby the upper surface 232 of the thermal chuck 190, at the top by thelower surface 24 of the wafer chuck component 12, and on the sides bythe thermal interface cavity seal 226 connecting the upper surface 232of the thermal chuck 190 with the lower surface 24 of the wafer chuckcomponent 12. The thermal interface vacuum passage 234 is permanentlyconnected to a pump through a valve (not shown), and air is pumped fromthe thermal interface cavity through the thermal interface vacuumpassage, thereby reducing a pressure within the thermal interfacecavity. The pressure within the thermal interface cavity is thus lowerthan ambient pressure above the portable pack 108 and ambient pressurebelow the thermal chuck 190. The thermal interface cavity reduces insize until the lower surface 24 of the wafer chuck component 12 contactsthe upper surface 232 of the thermal chuck 190 and the thermal interfacecavity seal 226 is compressed into its groove. The only remainingportion of the thermal interface cavity is then defined by the vacuumgrooves 240, and the reduced pressure is maintained within the vacuumgrooves 240 to keep the surfaces 24 and 232 against one another. Becausethe surfaces 24 and 232 are against one another, heat can conductbetween the thermal chuck 190 and the wafer chuck component 12 in bothdirections.

The vacuum port seal 244 seals with the lower surface 24 of the waferchuck component 12 around the outlet opening 156 of the pressurereduction passage 144. The pump maintains the vacuum port 242 at areduced pressure, and thus maintains the outlet opening 156 at a reducedpressure in case of leakage of the pressure reduction passage checkvalve 146.

The thermal chuck 190 is made up out of upper and lower pieces 252 and254 that are brazed to one another. A thermal control passage 256 ismachined into a lower surface of the upper piece 252. As specificallyshown in FIG. 9, the thermal control passage 256 has an inlet 258 and anoutlet 260 formed through the lower piece 254. A fluid can flow from theinlet 258 through successive sections of the thermal control passage andout of the outlet 260. A first half of the thermal control passage 256forms a first spiral 268 clockwise to a center of the thermal chuck 190in plan view. A second half of the thermal control passage 256 forms asecond spiral 270 counter-clockwise away from the center of the thermalchuck 190. Two sections of the first spiral 268 have one section of thesecond spiral 270 between them. Two sections of the second spiral 270have one section of the first spiral 268 between them. As such, thethermal control passage 256, for example, has first, second, and thirdsections in series after one another with the third section locatedbetween the first and second sections in cross-sectional plan view. Thethermal control passage 256 also has a fourth section in series afterthe third section. Depending on where the fourth section is selected,the fourth section can be either between the second and third sectionsor between the first and second sections. In either case, the first andsecond sections are sections of a first spiral and the third section isa section of a second spiral that is not located on the first spiral.

There may, for example, be a 10 degree Celsius difference in temperaturebetween the fluid flowing through the inlet 258 and the fluid flowingout of the outlet 260. Adjacent sections of the thermal control passage256 in an outer region of the thermal chuck 190 will then be attemperatures that are 10 degrees Celsius different. The temperaturebetween the two sections in the outer region of the thermal chuck 190will, however, be an average of the temperatures at the inlet 258 andthe outlet 260, i.e., five degrees Celsius above and below thetemperatures of the inlet 258 and the outlet 260. As heat conducts fromthe fluid as the fluid flows towards the center of the thermal chuck190, the temperature of the fluid between adjacent sections of thethermal control passage 256 near a center of the thermal chuck 190 mayonly be four degrees Celsius. However, the difference between thetemperatures of the adjacent sections of the thermal control passage 256near a center of the thermal chuck 190 is still the same as the averageof the temperatures of the inlet 258 and outlet 260. The thermal chuck190 thus has the same temperature in an outer region and near the centerthereof.

The adaptors 228 and 230 are mounted to the thermal chuck 190 and areconnected to the inlet 258 and the outlet 260.

FIG. 10 illustrates a tester apparatus 300 that includes a plurality ofcomponents shown in FIG. 8, including a plurality of portable packs 108,a plurality of thermal chucks 190, and a plurality of interfaceassemblies 189. Each portable pack 108 is connected to a respectivethermal chuck 190 and each portable pack 108 has a respective interfaceof lands that makes contact with a respective interface of pinsirrespective of the interface assemblies 189. The tester apparatus 300further includes a plurality of electric testers 302 and a thermalcontrol system 304.

One or two electric testers 302 are connected to each portable pack 108.Each electric tester 302 is configured to run a burn-in test accordingto a pre-programmed set of instructions. The instructions are utilizedto transmit electric signals and to receive electric signals through arespective one of the interface assemblies 189 to and from themicroelectronic circuits of the wafer substrates (not shown) held in theportable packs 108. The thermal control system includes inlet and outletpipes 306 and 308, inlet and outlet manifolds 310 and 312, a coolingheat exchanger 314, a recirculating pump 316, and a heater arrangement318. Each inlet pipe 306 is disconnected from a respective adaptor suchas the adaptor 228 in FIG. 9, and each outlet pipe 308 is connected to arespective adaptor, such as the adaptor 230 in FIG. 9. A closed loopvalve is formed by the thermal control passage 256 in one of the thermalchucks 190, one of the outlet pipes 308, the outlet manifold 312, a paththrough the heat exchanger 314, the pump 316, a path through the heaterarrangement 318, the inlet manifold 310, and one of the inlet pipes 306.The thermal control passages 256 of the thermal chucks 190 are connectedin parallel to the manifolds 310 and 312.

The heat exchanger 314 also has a path connected to a water supply andto a drain. Water at room temperature can flow through the heatexchanger 314 and heat can conduct to the water.

The heater arrangement 318 has an electric coil that is connected to avoltage supply. The electric coil heats up when the electric supply isswitched on. Heat can be transferred from the heating coil when currentflows therethrough.

In use, the components that define the recirculating path are initiallyfilled with oil. The pump 316 is switched on and the oil recirculatesthrough the heater arrangement 318, the inlet manifold 310, the inletpipes 306, the thermal chucks 190, the outlet pipes 308, the outletmanifold 312, and the heat exchanger 314 back to the pump 316. When thevoltage supply is switched on, the electric coil of the heaterarrangement 318 heats up, and heat transfers from the electric coil tothe oil. The oil is heated from room temperature of 21 degrees Celsiusto above 100 degrees Celsius, typically to a temperature ofapproximately 170 degrees Celsius. The oil at 170 degrees Celsius entersthe thermal chucks 190 and gradually heats the thermal chucks 190.Because heat is transferred to the thermal chucks 190, the oil leavingthe thermal chucks 190 through the outlet pipes 308 is at a lowertemperature, for example, 150 degrees Celsius. When the thermal chuck190 is heated to a temperature that is sufficiently high for purposes oftesting the integrated microelectronic circuits 90 in FIG. 2, theelectric tester then tests the integrated microelectronic circuits 90.Burn-in testing is typically carried out on the integratedmicroelectronic circuits 90.

As the integrated microelectronic circuits are tested, they graduallyheat up and need to be cooled to be maintained at the temperatureappropriate for burn-in testing. Current to the electric coil of theheater arrangement 318 is switched off. Water from the water supply isswitched on. Heat transfers from the oil to the water of the watersupply, thereby cooling the oil. The oil entering the thermal chucks 190may now, for example, be at 160 degrees Celsius, and oil leaving thethermal chucks 190 may be at 170 degrees Celsius. The heat exchanger 314cools the oil from 170 degrees Celsius to 160 degrees Celsius. Whatshould be noted is that the oil typically does not need to be cooled tobelow 150 degrees Celsius. According to tests that were conducted, itwas found that it was not necessary to drop the temperature of the oilto, for example, below 100 degrees Celsius or to room temperature.Instead, a high flow rate of oil, typically between 3 and 5 liters perminute, is sufficient to prevent the thermal chuck 190 from overheatingand to maintain the 170 degrees Celsius temperature.

Localized heating is used in a tester apparatus 300. A conventionalburn-in tester, by contrast, has a burn-in oven and burn-in portcarrying integrated microelectronic circuit packages which are insertedinto the burn-in oven. Heat converts from air in the burn-in oven to theintegrated microelectronic circuit packages and to the burn-in boards.In a general heating arrangement, heated air thus surrounds the burn-inboards that carry the integrated microelectronic circuit packages. Inthe localized heat arrangement of the tester apparatus of FIG. 10, airsurrounding the portable packs 108 is typically at approximately roomtemperature of 21 degrees Celsius, and the localized areas of portablepacks 108 are heated (or cooled) by the thermal chucks 190.

Localized heating has its own unique set of challenges. Referring againto FIGS. 3 and 4, the signal distribution board assembly 116 does notheat above room temperature by as much as the backing member 118 of thecontactor 170, and the backing member 118 of the contactor 170 does notheat above room temperature by as much as the wafer substrate 82. Thebacking member 118 of the contactor 170 may, for example, heat from 21degrees Celsius to 171 degrees Celsius, and the signal distributionboard assembly 116 may simultaneously heat from 21 degrees Celsius to121 degrees Celsius. The coefficients of thermal expansion of thebacking member 118 of the contactor 170 and the signal distributionboard assembly 116 are engineered so that the backing member 118 of thecontactor 170 and the signal distribution board assembly 116 expand andcontract at a similar rate. In the given example, a coefficient ofthermal expansion (CTE) of the signal distribution board assembly 116may be 10 parts per million (ppm) and the CTE of the backing member 118of the contactor 170 may be 4.5, while the CTE of the wafer substrate 82may be a given 3.2. In another example, the CTE of the signaldistribution board 116 may be between 5 and 6 or may even be lower thanthe CTE of the backing member 118 of the contactor 170 in a differentset of thermal conditions.

In the given example, the CTE ratio of the CTE of the signaldistribution board 116 to the CTE of the backing member 118 of thecontactor 170 is 2.22. The CTE ratio can be defined as follows:

${{CTE}\mspace{14mu} {ratio}} = \frac{{CTE}\mspace{14mu} {of}\mspace{14mu} {first}\mspace{14mu} {element}}{{CTE}\mspace{14mu} {of}\mspace{14mu} {second}\mspace{14mu} {element}}$

The signal distribution board 116 may heat up from a low signaldistribution board temperature to a high signal distribution boardtemperature, and the backing member 118 of the contactor 170 may heat upfrom a low contactor temperature to a high contactor temperature and atemperature ratio. A temperature increase ratio can be defined asfollows:

${{Temperature}\mspace{14mu} {increase}\mspace{14mu} {ratio}} = \frac{\begin{matrix}{\; \begin{matrix}{{{High}\mspace{14mu} {temperature}\mspace{14mu} {of}}\mspace{11mu}} \\{{{second}\mspace{14mu} {component}} -}\end{matrix}} \\{\mspace{14mu} \begin{matrix}{{low}\mspace{14mu} {temperature}\mspace{14mu} {of}} \\{{second}\mspace{14mu} {component}}\end{matrix}}\end{matrix}}{\begin{matrix}{\; \begin{matrix}{{{High}\mspace{14mu} {temperature}\mspace{14mu} {of}}\mspace{11mu}} \\{{{first}\mspace{14mu} {component}} -}\end{matrix}} \\{\mspace{14mu} \begin{matrix}{{low}\mspace{14mu} {temperature}\mspace{14mu} {of}} \\{{first}\mspace{14mu} {component}}\end{matrix}}\end{matrix}}$

A multiple of the CTE ratio and the temperature increase ratio can bedefined as follows:

CTE ratio X Temperature increase ratio=X

Ideally, X should be as close to 1 as possible. In a preferredembodiment, X should be closer to 1 than the CTE ratio. The CTE ratio istypically between 0.2 and 5, more preferably between 0.9 and 1.1, and Xis preferably between 0.8 and 1.2.

Reference is again made to FIG. 8. Upon completion of burn-in testing ofthe integrated microelectronic circuits 90, the holding structure 185 israised, thereby disconnecting the land interface of the portable pack108 from the interface assembly 189. The portable pack 108 is thenremoved from the holding structure 185 by sliding the portable pack 108in a direction out of the paper.

Reference is again made to FIG. 6. A vacuum release passage 272 isformed through the wafer chuck component 12 and a vacuum release valve274 is located within the vacuum release passage 272. The vacuum releasepassage 272 has first, second, and third portions 276, 278, and 280. Thefirst and second portions 276 and 278 are drilled respectively from thelower surface 24 and the upper surface 22 of the wafer chuck component12. The second portion 336 is drilled from the outer surface 20 andconnects the first and second portions 276 and 278 to one another. Thefirst portion 276 has an air inlet opening 282 and the second portion336 has an air outlet opening 284 within the pressure differentialcavity 140.

The vacuum release valve is a shuttle valve, and a release valve opening286 is formed in the lower surface 24 of the wafer chuck component 12 ona side of the vacuum release valve 274 opposing the air outlet opening284 of the vacuum release passage 272. The air inlet opening 282 isnormally maintained at ambient pressure. The lower pressure within thepressure differential cavity 140 keeps a ball valve component 288 of thevacuum release valve 274 on a seat 290 thereof. In order to open theportable pack 108, a pressure on the release valve opening 286 isreduced to below the pressure within the pressure differential cavity140. A pressure differential between the pressure differential cavity140 and the release valve opening 286 moves the ball valve component 288off the seat 290. The air inlet opening 282 is then placed incommunication with the air outlet opening 284, and air flows through thevacuum release passage 272 into the pressure differential cavity 140.The pressure differential cavity 140 returns to ambient pressure.Because the pressure differential cavity 140 is at the same pressure asair outside the portable pack 108, the distribution board assembly 110can be lifted off the wafer substrate 82 and the wafer chuck assembly10. The wafer substrate 82 can then be removed from the wafer chuckassembly 10.

FIG. 11 illustrates two of the substrates 214 shown in FIGS. 7 and 8that form a single interface, and also shows one of the electric testers302 of FIG. 10.

The electric tester 302 includes a backplane 322, a configurable powerboard (CPB) 324, a pin electronics board (PEB) 326, a test electronicsboard (TEB) 328, a die power board (DPB) 330, and a plurality of powerbuses 333. The configurable power board 324 and the pin electronicsboard 326 are structurally connected to the die power board 330 throughthe backplane 322. The configurable power board 324 and the pinelectronics board 326 are also electrically connected to respective onesof the power buses 333. The test electronics board 328 is mounted on topand electrically connected to the pin electronics board 326.

The electric tester 302 is thermally and mechanically disconnected fromthe substrate 214. A plurality of flexible attachments (not shown) isused to connect the die power board 330 to the substrate 214. Aplurality of connectors 332 are located on the substrate 214 and areconnected to the contacts 216 in FIG. 7 via the conductors 218. Anotherset of connectors 334 are located on the die power board 330. Eachflexible attachment has two connectors at opposing ends. One of theconnectors of the flexible attachment is connected to one of theconnectors 332, and the opposing connector of the flexible attachment isconnected to one of the connectors 334.

Power, signal, and ground can be provided by the configurable powerboard 324 and the pin and test electronics boards 326 and 328 throughconnectors 335 in the backplane 322, the die power board 330, and theflexible attachments to the integrated circuits 92 of FIG. 2. Each oneof the boards 324, 326, 328, and 330 has a respective substrate and arespective circuit or circuits on the respective substrate, throughwhich power, ground, or signals can be provided to or from the circuits92.

As illustrated in FIG. 12, the configurable power board 324 includesfour power supply circuits 340 (IBC48V to 12V@500 W). The power supplycircuits 340 are connected to one another in parallel. Should one of thepower supply circuits 340 fail, power is still provided by the remainingpower supply circuits 340. The four power supply circuits 340 are thus nplus one, wherein n is 3. Should one of the power supply circuits 340fail, power will still be provided by n power supply circuits 340.

A current-sharing circuit connects the power supply circuits 340 topower buses 341. The current-sharing circuit detects when power from oneof the power supply circuits 340 reduces to below zero. Upon detectionof loss in power in one of the n plus one power supply circuits 340, thecurrent-sharing circuit switches a connection from the one of the n plusone power supply circuits 340 that has failed off, to eliminate currentfrom the failed one of the n plus one power supply circuits 340. Currentis then shared by the n power supply circuits 340 that have not failed.

FIG. 13A shows that each one of the power supply circuits 340 isconnected to a respective fault-detection circuit 342. Thefault-detection circuits 342 jointly make up the current-sharing circuitof FIG. 12. Each one of the fault-detection circuits 342 detects powerloss from a respective one of the power supply circuits 340, anddisconnects the respective power supply circuit 340 from a power bus341. In the fault-detection circuit 342, the voltage in (VIN) must bemore positive than the voltage out (VOUT) in order for the power supplycircuit 340 to be connected to the power bus 341. If VIN is not morepositive than VOUT, GATE is deenergized and a fault signal is providedon a fault line (IBCFAULTIN). In FIG. 12, the fault is provided to thepower supply control circuitry 344, which is connected to a control line(IBC_INHIBIT_N). The power control circuitry 344 can be used to switchpower provided by the power supply circuit 340 on or off. All the powersupply circuits 340 are under the control of the power supply controlcircuitry 344.

The power supply control circuitry 344 is also powered by the powersupply circuits 340 through the power bus 341. The power supply controlcircuitry 344 is programmed to control which ones of the power supplycircuits 340 are switched on and which ones are switched off. One of thepower supply circuits 340 is always on, so that power is always providedto the power supply control circuitry 344. As such, loss of power to thepower supply control circuitry 344 is avoided and does not have to berestarted and reprogrammed. The power supply control circuitry 344 isthus utilized to switch between a test mode, wherein power is providedby all four of the power supply circuits 340, and a power-save mode,wherein power is provided by only one of the power supply circuits 340.The current-sharing circuit detects that power is lost by all except oneof the power supply circuits 340, and disconnects all of the powersupply circuits 340 from the power bus 341, except for one of the powersupply circuits 340.

The circuits shown in FIG. 13A provide 12V power to the power bus 341.FIG. 12 shows a voltage masters DACS and MUXES circuit 346 that is alsoshown in FIG. 13B. The circuit in FIG. 13B establishes four mastervoltage levels (HIC_VMASTER0 to HIC_VMASTER4). The master voltages areregulated by separate digital-to-analog converters (12BITDAC). As such,the circuit of FIG. 13B can simultaneously provide four differentvoltages, each capable of five different levels switched by amultiplexer (DG408). The circuit of FIG. 13B is under the control of thepower supply control circuitry 344 of FIG. 12.

Referring again to FIG. 12, the voltage masters DACS and MUXES circuit346 is connected to high-current slaves 348, high-voltage slaves 350,and additional slaves 352. Each high-current slave 348 is arranged in“primary” groups of six high-current modules. Eight “primary” groups ofhigh-current slaves 348 are arranged in a “super” group of 48high-current modules. Four high-voltage slaves 350 are arranged in a“primary” group of high-voltage slaves 350, and four “primary” groups ofhigh-voltage slaves 350 are arranged in one “super” group of 16high-voltage modules. The four voltages provided by the voltage mastersDACS and MUXES circuit 346 are provided to each “primary” group ofhigh-current slaves 348 and each “primary” group of high-voltage slaves350 on four separate lines.

FIG. 13C illustrates one of the “primary” groups of high-current slaves348 of FIG. 12. Six current amplifiers 356 are provided. Voltage-adjustlines (VADJ) of the current amplifiers 356 are connected to a commonline 358. The line 358 is connected through a switch 360, two amplifiers362 and 364, and a voltage selector 366 to the four voltage lines(VMASTER) on the right in the circuit in FIG. 13B. The voltage selector366 is used to select a respective one of four voltages that is providedto the current amplifiers 356.

FIG. 14 illustrates one of the current amplifiers 356 of FIG. 13C. Thecurrent amplifier 356 has a current amplification module 370, anamplifier 372, a switch 374, and first and second input lines 376 and378 to the amplifier 372.

The current amplification module 370 has a voltage reference (V0ADJ),and is connected to the 12V power supply on the power bus 341 in FIG.13A to apply current to an output (VOUT).

The voltage reference line (V0ADJ) is connected through the amplifier372 and the first input line 376 to the common line 358 in FIG. 13C. Thecurrent amplification module 370 drives the output (VOUT) to the samevoltage as the voltage reference line (V0ADJ). When the switch 374 is ina first configuration, where the second input line 378 is disconnectedfrom a sense line (VSENSE), a voltage on the second input line 378follows VOUT, thereby keeping VOUT locally locked to VADJ.

When the switch 374 is in a second configuration, where the sense line(VSENSE) is connected to the second input line 378 of the amplifier 372,the reference (V0AJD) on the amplification module 370 follows the remotevoltage on the sense line (VSENSE). The voltage on the output (VOUT) isthen under the control of the sense line (VSENSE). It should beunderstood that the output (VOUT) and the input (VSENSE) are bothultimately connected to the terminals 92 of the substrate 82 in FIG. 2.

Referring again to FIG. 13C, each one of the current amplifiers 356 hasa separate output (VOUT) and a separate sense line (VSENSE). A separatevoltage can be sensed on the respective sense lines, and current to therespective output lines can be different when the current configurationcircuit shown in FIGS. 13C and 14 is in the second configuration.

In the second configuration, the switch 360 connects the common line 358to the amplifier 362. In the first configuration, the switch 360connects the common line 358 to an output of an amplifier 384. Theamplifier 384 has first and second input lines 386 and 388. The firstinput line 386 is connected to an output from the amplifier 362. Thesecond input line 388 is connected to the sense line (VSENSE0) of onlyone of the current amplifiers 356. The voltage on the common line 358thus follows a voltage on the sense line (VSENSE0) when the currentconfiguration circuit of FIGS. 13C and 14 is in the first configuration.

Referring again to FIG. 12, each “primary” group of high-voltage slaves350 includes a circuit that is the same as the current configurationcircuit of FIG. 13C, except that each one of the current amplifiers 356is used as a current and voltage amplifier. Each one of the current andvoltage amplifiers has a respective circuit, as shown in FIG. 15. Thevoltage and current amplifier of FIG. 15 is the same as the currentamplifier of FIG. 14, except that four voltage divider resistors R1, R2,R3, and R4 are provided, and the current amplification module 370 inFIG. 14 serves as a current and voltage amplification module. A senseline (HIV_VSENSE) is connected through the resistor R1 to the switch374. The sense line (HIV_VSENSE) is also connected to the resistors R1and R2 to ground. The resistors R1 and R2 thus serve as voltage dividersof the voltage on the sense line (HIV_VSENSE) to the switch 374.

Similarly, the switch 374 is connected through the resistor R4 to avoltage sense line (VSENSE) and an output (VOUT) on the voltage andcurrent amplification module 370, and the same terminal on the switch374 is also connected through the resistor R3 to ground. The voltage andcurrent amplification module 370 amplifies voltage depending on avoltage on the VTRIM line thereof.

It can thus be seen, with reference in particular to FIGS. 13 and 14,that an operator can switch between first and second configurations. Inthe first configuration, current of, for example, 60 A can be providedand be shared by six slaved module outputs. In the second configuration,approximately 10 A can be provided by each one of the six differentmodule outputs, and the currents can float independently of one another.

While certain exemplary embodiments have been described and shown in theaccompanying drawings, it is to be understood that such embodiments aremerely illustrative and not restrictive of the current invention, andthat this invention is not restricted to the specific constructions andarrangements shown and described since modifications may occur to thoseordinarily skilled in the art.

1-519. (canceled)
 520. A tester apparatus, comprising: an electrical tester for connection through contacts to a plurality of terminals of at least one substrate carrying at least one integrated circuit and having the terminals connected to the integrated circuit so that current conducts between the electrical tester and the integrated circuit to test the integrated circuit, wherein the electric tester includes a plurality of power supply circuits connected to the contacts, wherein power is provided through the plurality of power supply circuits connected to the contacts; and a power supply control circuit powered from at least one of the plurality of power supply circuits, the power supply control circuit switching the power supply circuits between a test mode wherein power is provided by a first number of the plurality of power supply circuits, and a power save mode wherein power is provided by a second number of the power supply circuits, the second number being less than the first number.
 521. The tester apparatus of claim 520, wherein there is a plurality of n plus one power supply circuits connected to one another in parallel such that power is provided to the integrated circuit by n plus one of the power supply circuits, and if one of the power supplies fails, power is still provided to the integrated circuit by n of the circuits.
 522. The tester apparatus of claim 521, further comprising: a current-sharing circuit that (i) detects at least a reduction in power of one of the n plus one power supply circuits and (ii) switches a connection from the one of the n plus one power supply circuits off to eliminate current from the one of the n plus one power supplies so that current is shared by the n power circuits.
 523. The tester apparatus of claim 522, wherein the current-sharing circuit includes a plurality of fault-detection circuits, each detecting power loss from a respective one of the power supply circuits.
 524. tester apparatus of claim 520, further comprising: signal electronics that provide signals to the integrated circuit.
 525. The tester apparatus of claim 520, further comprising: a supporting structure for holding the at least one substrate; and a plurality of contacts matching the terminals for making contact to the terminals, the electrical tester being connected through the contacts to the terminals so that current conducts between the electrical tester and the integrated circuit to test the integrated circuit.
 526. A method of testing at least one circuit held by at least one substrate, comprising: locating contacts against terminals of the substrate connected to the integrated circuit; conducting current between an electrical tester and the integrated circuit through the terminals and contacts to test the integrated circuit, wherein power is provided through a power supply circuit connected to the contacts; and switching the power supply circuits between a test mode wherein power is provided by a first number of the plurality of power supply circuits, and a power save mode wherein power is provided by a second number of the power supply circuits, the second number being less than the first number.
 527. The method of claim 526, wherein there is a plurality of n plus one power supply circuits connected to one another in parallel such that power is provided to the integrated circuit of the at least one substrate by n plus one of the power supply circuits, still providing current to the integrated circuit by n of the circuits upon failure of one of the power supplies.
 528. The method of claim 527, further comprising: detecting at least a reduction in power of one of the n plus one power supplies; and switching a connection from the one of the n plus one power supplies off to eliminate current from the one of the n plus one power supplies so that current is shared by the n power circuits.
 529. The method of claim 528, further comprising: detecting power loss from each one of the power supply circuits with a separate fault-detection circuit.
 530. The method of claim 526, further comprising: providing signals to the integrated circuit. 531-548. (canceled) 